- flip-chip technology
- Микроэлектроника: технология монтажа методом перевёрнутого кристалла
Универсальный англо-русский словарь. Академик.ру. 2011.
flip-chip technology
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Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
Chip tridimensional (3D) — En electrónica, un circuito integrado tridimensional, o simplemente chip tridimensional (chip 3D), es un chip compuesto por dos o más capas de componentes electrónicos activos, integrados tanto vertical como horizontalmente, y formando un único… … Wikipedia Español
Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Chip-On-Board-Technologie — Beispiel eines LCD Moduls, welches in COB Technologie ausgeführt ist Die Chip on Board Technologie (Abk.: COB, deutsch Nacktchipmontage) ist eine Technologie zur Direktmontage von ungehäusten Halbleiter Chips auf Leiterplatten zu einer… … Deutsch Wikipedia
IBM Solid Logic Technology — Solid Logic Technology (SLT) was IBM s method for packaging electronic circuitry introduced in 1964 with the IBM System/360 series and related machines. IBM chose to design custom hybrid circuits using discrete, flip chip mounted, glass… … Wikipedia
PLX Technology — PLX Technology, Inc., PLX Technology, Inc. (NASDAQ:PLXT) is based in Sunnyvale, California, USA, and is a supplier of PCI Express and other standard I/O interconnect semiconductors to the communications, server, storage, embedded control, and… … Wikipedia
Comparison of display technology — This is a comparison of various properties of different display technologies. Further information: Comparison CRT, LCD, Plasma and History of display technology Contents 1 General characteristics 2 Temporal characteristics 3 See also … Wikipedia
Creative Technology — This article is about the company. For the university degree, see Master in Creative Technologies. For the advertising slogan, see Citroën. Creative Technology Ltd. Type Public (SGX … Wikipedia
Power network design (IC) — In integrated circuits, electrical power is distributed to the components of the chip over a network of conductors on the chip. Power network design (IC) includes the analysis and design of such networks. As in all engineering, this involves… … Wikipedia
System in package — A System in a Package or System in Package (SiP), also known as a Chip Stack MCM, is a number of integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically… … Wikipedia
